View CC2640R2F-Q1_9041796.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. advance information for pre-production products; subject to change without notice. CC2640R2F-Q1 swrs201 ? january 2017 CC2640R2F-Q1 simplelink ? bluetooth ? low energy wireless mcu for automotive 1 device overview 1 1.1 features 1 ? qualified for automotive applications ? aec-q100 qualified with the following results: ? device temperature grade 2: ? ? 40 c to +105 c ambient operating temperature range ? device hbm esd classification level 2 ? device cdm esd classification level c3 ? microcontroller ? powerful arm ? cortex ? -m3 ? eembc coremark ? score: 142 ? up to 48-mhz clock speed ? 275kb of nonvolatile memory, including 128kb of in-system programmable flash ? up to 28kb of system sram, of which 20kb is ultra-low-leakage sram ? 8kb of sram for cache or system ram use ? 2-pin cjtag and jtag debugging ? supports over-the-air upgrade (ota) ? ultra-low power sensor controller ? can run autonomously from the rest of the system ? 16-bit architecture ? 2kb of ultra-low leakage sram for code and data ? efficient code size architecture, placing drivers, bluetooth ? low energy controller, and bootloader in rom to make more flash available for the application ? rohs-compliant automotive grade package ? 7-mm 7-mm rgz vqfn48 with wettable flanks ? peripherals ? all digital peripheral pins can be routed to any gpio ? four general-purpose timer modules (eight 16-bit or four 32-bit timers, pwm each) ? 12-bit adc, 200-ksamples/s, 8-channel analog mux ? continuous time comparator ? ultra-low power analog comparator ? programmable current source ? uart ? 2 ssi (spi, microwire, ti) ? i2c ? i2s ? real-time clock (rtc) ? aes-128 security module ? true random number generator (trng) ? 31 gpios ? support for eight capacitive-sensing buttons ? integrated temperature sensor ? external system ? on-chip internal dc-dc converter ? very few external components ? seamless integration with the simplelink ? cc2590 and cc2592 range extenders ? low power ? wide supply voltage range: 1.8 to 3.8 v ? active-mode rx: 6.1 ma ? active-mode tx at 0 dbm: 6.1 ma ? active-mode tx at +5 dbm: 9.1 ma ? active-mode mcu: 61 a/mhz ? active-mode mcu: 48.5 coremark/ma ? active-mode sensor controller: 0.4 ma + 8.2 a/mhz ? standby: 1.1 a (rtc running and ram/cpu retention) ? shutdown: 100 na (wake up on external events) ? rf section ? 2.4-ghz rf transceiver compatible with bluetooth low energy (ble) 4.2 and 5 specifications ? excellent receiver sensitivity ( ? 96 dbm for bluetooth low energy 1 mbps), selectivity, and blocking performance ? programmable output power up to +5 dbm ? link budget of 101 db for bluetooth low energy 1 mbps ? suitable for systems targeting compliance with worldwide radio frequency regulations ? etsi en 300 328 (europe) ? en 300 440 class 2 (europe) ? fcc cfr47 part 15 (us) ? arib std-t66 (japan) ? tools and development environment ? full-feature development kits ? packet sniffer pc software ? sensor controller studio advance information productfolder ordernow technical documents tools & software support &community
2 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 device overview copyright ? 2017, texas instruments incorporated ? smartrf ? studio ? smartrf flash programmer 2 ? iar embedded workbench ? for arm ? code composer studio ? 1.2 applications ? automotive applications ? car access ? keyless entry ? passive entry/passive start (peps) systems ? car sharing ? piloted parking ? wireless onboard diagnostics ? cable replacement ? remote control ? sensors ? industrial ? logistics ? production and manufacturing automation ? asset tracking and management ? hmi and remote display ? access control (1) for more information, see section 9 . 1.3 description the simplelink ? bluetooth ? low energy CC2640R2F-Q1 device is an aec-q100 compliant wireless microcontroller (mcu) targeting bluetooth 4.2- and bluetooth 5 low energy automotive applications such as passive entry/passive start (peps), remote keyless entry (rke), car sharing, piloted parking, and smartphone connectivity. the device is a member of the simplelink ultra-low power family of cost-effective, 2.4-ghz rf devices. very-low active rf and mcu current and low-power mode current consumption provides excellent battery lifetime allowing for operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. excellent receiver sensitivity and programmable output power provides industry leading rf performance that is required for the demanding automotive rf environment. the CC2640R2F-Q1 wireless mcu contains a 32-bit arm ? cortex ? -m3 processor that runs at 48 mhz as the main application processor and includes the bluetooth 4.2 low energy controller and host libraries embedded in rom. this architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application. additionally, the device is aec-q100 qualified at the grade 2 temperature range ( ? 40 c to +105 c) and is offered in a 7-mm 7-mm vqfn package with wettable flanks. the wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points. the bluetooth low energy software stack is available free of charge from ti.com . device information (1) part number package body size (nom) cc2640r2ftwrgzq1 vqfn (48) with wettable flanks 7.00 mm 7.00 mm advance information
3 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 device overview copyright ? 2017, texas instruments incorporated 1.4 functional block diagram figure 1-1 shows a block diagram for the CC2640R2F-Q1 device. figure 1-1. block diagram advance information aec-q100 automotive grade simplelink CC2640R2F-Q1 wireless mcu main cpu 128-kb flash s ensor controller cjtag 20-kb sram rom arm cortex-m3 dc-dc converter rf core arm cortex-m0 dsp modem 4-kb sram rom sensor controller engine 2 comparator 12-bit adc, 200 ks/s constant current source spi-i2c digital sensor if 2-kb sram time-to-digital converter g eneral peripherals / modules 4 32-bit timers 2 ssi (spi, w, ti) watchdog timer temp. / batt. monitor rtc i2c uart i2s 31 gpios aes 32 ch. dma adc digital pll trng adc 8-kb cache copyright ? 2017, texas instruments incorporated
4 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 revision history copyright ? 2017, texas instruments incorporated table of contents 1 device overview ......................................... 1 1.1 features .............................................. 1 1.2 applications ........................................... 2 1.3 description ............................................ 2 1.4 functional block diagram ............................ 3 2 revision history ......................................... 4 3 device comparison ..................................... 5 3.1 related products ..................................... 5 4 terminal configuration and functions .............. 6 4.1 pin diagram ? rgz package ........................ 6 4.2 signal descriptions ? rgz package ................. 7 4.3 wettable flanks ...................................... 8 5 specifications ............................................ 9 5.1 absolute maximum ratings .......................... 9 5.2 esd ratings .......................................... 9 5.3 recommended operating conditions ................ 9 5.4 power consumption summary ...................... 10 5.5 general characteristics ............................. 10 5.6 1-mbps gfsk (bluetooth ? low energy technology) ? rx ................................... 11 5.7 1-mbps gfsk (bluetooth ? low energy technology) ? tx ................................... 12 5.8 24-mhz crystal oscillator (xosc_hf) ............. 12 5.9 32.768-khz crystal oscillator (xosc_lf) .......... 12 5.10 48-mhz rc oscillator (rcosc_hf) ............... 13 5.11 32-khz rc oscillator (rcosc_lf) ................. 13 5.12 adc characteristics ................................. 13 5.13 temperature sensor ................................ 14 5.14 battery monitor ...................................... 14 5.15 continuous time comparator ....................... 14 5.16 low-power clocked comparator ................... 15 5.17 programmable current source ..................... 15 5.18 synchronous serial interface (ssi) ................ 15 5.19 dc characteristics .................................. 17 5.20 thermal resistance characteristics ................ 18 5.21 timing requirements ............................... 19 5.22 switching characteristics ........................... 19 5.23 typical characteristics .............................. 20 6 detailed description ................................... 22 6.1 overview ............................................ 22 6.2 functional block diagram ........................... 22 6.3 main cpu ........................................... 23 6.4 rf core ............................................. 23 6.5 sensor controller ................................... 24 6.6 memory .............................................. 25 6.7 debug ............................................... 25 6.8 power management ................................. 26 6.9 clock systems ...................................... 27 6.10 general peripherals and modules .................. 27 6.11 voltage supply domains ............................ 28 6.12 system architecture ................................. 28 7 application, implementation, and layout ......... 29 7.1 application information .............................. 29 7.2 7 7 internal differential (7id) application circuit . 31 8 device and documentation support ............... 33 8.1 device nomenclature ............................... 33 8.2 tools and software ................................. 34 8.3 documentation support ............................. 35 8.4 texas instruments low-power rf website ........ 35 8.5 community resources .............................. 35 8.6 additional information ............................... 36 8.7 trademarks .......................................... 36 8.8 electrostatic discharge caution ..................... 36 8.9 export control notice ............................... 36 8.10 glossary ............................................. 36 9 mechanical, packaging, and orderable information .............................................. 36 9.1 packaging information .............................. 36 2 revision history date revision notes january 2017 swrs201* initial release advance information
5 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 device comparison copyright ? 2017, texas instruments incorporated (1) package designator replaces the xxx in device name to form a complete device name, rgz is 7-mm 7-mm vqfn48, rhb is 5-mm 5-mm vqfn32, rsm is 4-mm 4-mm vqfn32, and yfv is 2.7-mm 2.7-mm dsbga.. (2) cc2640r2fxxx devices contain bluetooth 4.2 host and controller libraries in rom, leaving more of the 128kb of flash available for the customer application when used with supported ble-stack software protocol stack releases. actual use of rom and flash by the protocol stack may vary depending on device software configuration. see bluetooth low energy stack for more details. 3 device comparison table 3-1. device family overview device phy support flash (kb) ram (kb) gpio package (1) CC2640R2F-Q1 (2) bluetooth low energy (automotive) 128 20 31 rgz (wettable flanks) cc2640r2fxxx (2) bluetooth low energy (normal, high speed, long range) 128 20 31, 15, 14, 10 rgz, rhb, yfv, rsm cc2650f128xxx multi-protocol 128 20 31, 15, 10 rgz, rhb, rsm cc2640f128xxx bluetooth low energy (normal) 128 20 31, 15, 10 rgz, rhb, rsm cc2630f128xxx ieee 802.15.4 ( zigbee ? /6lowpan) 128 20 31, 15, 10 rgz, rhb, rsm cc2620f128xxx ieee 802.15.4 (rf4ce) 128 20 31, 10 rgz, rsm (1) actual use of rom and flash by the protocol stack will vary depending on device software configuration. the values in this table are provided as guidance only. (2) application example with two services (gap and simple profile). compiled using iar. (3) bt4.2 configuration including secure pairing, privacy 1.2, and data length extension (4) bluetooth low energy applications running on the CC2640R2F-Q1 device make use of up to 115 kb of system rom and up to 32 kb of rf core rom in order to minimize the flash usage. the maximum amount of nonvolatile memory available for bluetooth low energy applications on CC2640R2F-Q1 is thus 275 kb (128-kb flash + 147-kb rom). table 3-2. typical (1) flash memory available for customer applications device simple ble peripheral (bt 4.0) (2) simple ble peripheral (bt 4.2) (2) (3) cc2640r2fxxx, CC2640R2F-Q1 (4) 83 kb 80 kb cc2640f128xxx, cc2650f128xxx 41 kb 31 kb 3.1 related products wireless connectivity the wireless connectivity portfolio offers a wide selection of low power rf solutions suitable for a broad range of applications. the offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol). ti ' s simplelink ? sub-1 ghz wireless mcus long-range, low-power wireless connectivity solutions are offered in a wide range of sub-1 ghz ism bands. companion products review products that are frequently purchased or used in conjunction with this product. simplelink ? cc2640r2 wireless mcu launchpad ? development kit the cc2640r2 launchpad ? development kit brings easy bluetooth ? low energy (ble) connection to the launchpad ecosystem with the simplelink ultra-low power cc26xx family of devices. compared to the cc2650 launchpad, the cc2640r2 launchpad provides the following: ? more free flash memory for the user application in the cc2640r2 wireless mcu ? out-of-the-box support for bluetooth 4.2 specification ? 4 faster over-the-air download speed compared to bluetooth 4.1 simplelink ? bluetooth low energy/multi-standard sensortag the new sensortag iot kit invites you to realize your cloud-connected product idea. the new sensortag now includes 10 low-power mems sensors in a tiny red package. and it is expandable with devpacks to make it easy to add your own sensors or actuators. reference designs for cc2640 ti designs reference design library is a robust reference design library spanning analog, embedded processor and connectivity. created by ti experts to help you jump-start your system design, all ti designs include schematic or block diagrams, boms and design files to speed your time to market. search and download designs at ti.com/tidesigns. advance information
6 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 terminal configuration and functions copyright ? 2017, texas instruments incorporated 4 terminal configuration and functions 4.1 pin diagram ? rgz package note: the following i/o pins marked in bold have high-drive capabilities. ? pin 10: dio_5 ? pin 11: dio_6 ? pin 12: dio_7 ? pin 24: jtag_tmsc ? pin 26: dio_16 ? pin 27: dio_17 note: the following i/o pins marked in italics have analog capabilities. ? pin 36: dio_23 ? pin 37: dio_24 ? pin 38: dio_25 ? pin 39: dio_26 ? pin 40: dio_27 ? pin 41: dio_28 ? pin 42: dio_29 ? pin 43: dio_30 figure 4-1. 48-pin rgz package with wettable flanks 7-mm 7-mm pinout, 0.5-mm pitch top view advance information 40 39 dio_25 38 dio_24 37 21 22 23 24 dcdc_sw 33 dio_18 34 reset_n 35 dio_23 36 x32k_q2 4 x32k_q1 3 rf_n 2 rf_p 1 dio_22 32 dio_21 31 dio_20 30 dio_19 29 dio_0 5 dio_1 6 dio_2 7 8 28 27 26 jtag_tckc 25 9 10 11 12 41 42 43 44 20 dio_15 19 dio_14 18 17 vddr 45 46 47 vddr_rf 48 16 15 14 13 dio_17 dio_16 vdds_dcdc dio_26 dio_12 dio_13 vdds2 dio_11 dio_10 dio_5 dio_6 dio_7 dio_3 dio_4 x24m_p x24m_n dio_8 dio_9 dio_28 vdds3 dcoupl jtag_tmsc dio_29 dio_30 dio_27 vdds
7 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 terminal configuration and functions copyright ? 2017, texas instruments incorporated (1) see technical reference manual listed in section 8.3 for more details. (2) do not supply external circuitry from this pin. (3) if internal dc-dc is not used, this pin is supplied internally from the main ldo. (4) if internal dc-dc is not used, this pin must be connected to vddr for supply from the main ldo. 4.2 signal descriptions ? rgz package table 4-1. signal descriptions ? rgz package name no. type description dcdc_sw 33 power output from internal dc-dc (1) dcoupl 23 power 1.27-v regulated digital-supply decoupling capacitor (2) dio_0 5 digital i/o gpio, sensor controller dio_1 6 digital i/o gpio, sensor controller dio_2 7 digital i/o gpio, sensor controller dio_3 8 digital i/o gpio, sensor controller dio_4 9 digital i/o gpio, sensor controller dio_5 10 digital i/o gpio, sensor controller, high-drive capability dio_6 11 digital i/o gpio, sensor controller, high-drive capability dio_7 12 digital i/o gpio, sensor controller, high-drive capability dio_8 14 digital i/o gpio dio_9 15 digital i/o gpio dio_10 16 digital i/o gpio dio_11 17 digital i/o gpio dio_12 18 digital i/o gpio dio_13 19 digital i/o gpio dio_14 20 digital i/o gpio dio_15 21 digital i/o gpio dio_16 26 digital i/o gpio, jtag_tdo, high-drive capability dio_17 27 digital i/o gpio, jtag_tdi, high-drive capability dio_18 28 digital i/o gpio dio_19 29 digital i/o gpio dio_20 30 digital i/o gpio dio_21 31 digital i/o gpio dio_22 32 digital i/o gpio dio_23 36 digital/analog i/o gpio, sensor controller, analog dio_24 37 digital/analog i/o gpio, sensor controller, analog dio_25 38 digital/analog i/o gpio, sensor controller, analog dio_26 39 digital/analog i/o gpio, sensor controller, analog dio_27 40 digital/analog i/o gpio, sensor controller, analog dio_28 41 digital/analog i/o gpio, sensor controller, analog dio_29 42 digital/analog i/o gpio, sensor controller, analog dio_30 43 digital/analog i/o gpio, sensor controller, analog jtag_tmsc 24 digital i/o jtag tmsc, high-drive capability jtag_tckc 25 digital i/o jtag tckc reset_n 35 digital input reset, active-low. no internal pullup. rf_p 1 rf i/o positive rf input signal to lna during rx positive rf output signal to pa during tx rf_n 2 rf i/o negative rf input signal to lna during rx negative rf output signal to pa during tx vddr 45 power connect to output of internal dc-dc (2) (3) vddr_rf 48 power connect to output of internal dc-dc (2) (4) advance information
8 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 terminal configuration and functions copyright ? 2017, texas instruments incorporated table 4-1. signal descriptions ? rgz package (continued) name no. type description vdds 44 power 1.8-v to 3.8-v main chip supply (1) vdds2 13 power 1.8-v to 3.8-v dio supply (1) vdds3 22 power 1.8-v to 3.8-v dio supply (1) vdds_dcdc 34 power 1.8-v to 3.8-v dc-dc supply x32k_q1 3 analog i/o 32-khz crystal oscillator pin 1 x32k_q2 4 analog i/o 32-khz crystal oscillator pin 2 x24m_n 46 analog i/o 24-mhz crystal oscillator pin 1 x24m_p 47 analog i/o 24-mhz crystal oscillator pin 2 egp power ground ? exposed ground pad 4.3 wettable flanks the automotive industry requires original equipment manufacturers (oems) to perform 100% automatic visual inspection (avi) post-assembly to ensure that cars meet the current demands for safety and high reliability. standard quad-flat no-lead (vqfn) packages do not have solderable or exposed pins/terminals that are easily viewed. it is therefore difficult to determine visually whether or not the package is successfully soldered onto the printed circuit board (pcb). to resolve the issue of side-lead wetting of leadless packaging for automotive and commercial component manufacturers, the wettable-flank process was developed. the wettable flanks on the vqfn package provide a visual indicator of solderability and thereby lower the inspection time and manufacturing costs. the CC2640R2F-Q1 device is assembled using an automotive-grade vqfn package with wettable flanks. advance information
9 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) all voltage values are with respect to ground, unless otherwise noted. (2) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (3) including analog-capable dio. (4) each pin is referenced to a specific vddsx (vdds, vdds2, or vdds3). for a pin-to-vdds mapping table, see table 6-3 . 5 specifications 5.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) (2) min max unit supply voltage (vdds, vdds2, and vdds3) vddr supplied by internal dc-dc regulator or internal gldo. vdds_dcdc connected to vdds on pcb. ? 0.3 4.1 v voltage on any digital pin (3) (4) ? 0.3 vddsx + 0.3, max 4.1 v voltage on crystal oscillator pins, x32k_q1, x32k_q2, x24m_n and x24m_p ? 0.3 vddr + 0.3, max 2.25 v voltage on adc input (v in ) voltage scaling enabled ? 0.3 vdds v voltage scaling disabled, internal reference ? 0.3 1.49 voltage scaling disabled, vdds as reference ? 0.3 vdds / 2.9 input rf level 5 dbm t stg storage temperature ? 40 150 c (1) aec q100-002 indicates hbm stressing is done in accordance with the ansi/esda/jedec js-001 specification. (2) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (3) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 5.2 esd ratings value unit v esd electrostatic discharge human body model (hbm), per aec q100-002 (1) (2) all pins 2000 v charged device model (cdm), per aec q100-011 (3) all pins 250 5.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit ambient temperature ? 40 105 c operating supply voltage vdds for operation in battery-powered and 3.3-v systems (internal dc-dc can be used to minimize power consumption) 1.8 3.8 v operating supply voltages vdds2 and vdds3 vdds < 2.7 v 1.8 3.8 v operating supply voltages vdds2 and vdds3 vdds 2.7 v 1.9 3.8 v advance information
10 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) differential rf mode is optimized for rf performance. measured on cc2640q1em-7id. (2) i peri is not supported in standby or shutdown. 5.4 power consumption summary measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v with internal dc-dc converter, unless otherwise noted. parameter test conditions min typ max unit i core core current consumption reset. reset_n pin asserted or vdds below power-on-reset threshold 100 na shutdown. no clocks running, no retention 150 standby. with rtc, cpu, ram and (partial) register retention. rcosc_lf 1.1 a standby. with rtc, cpu, ram and (partial) register retention. xosc_lf 1.3 standby. with cache, rtc, cpu, ram and (partial) register retention. rcosc_lf 2.8 standby. with cache, rtc, cpu, ram and (partial) register retention. xosc_lf 3.0 idle. supply systems and ram powered. 550 active. core running coremark 1.45 ma + 31 a/mhz radio rx (1) 6.1 ma radio tx, 0-dbm output power 6.1 radio tx, 5-dbm output power (1) 9.1 peripheral current consumption (adds to core current i core for each peripheral unit activated) (2) i peri peripheral power domain delta current with domain enabled 20 a serial power domain delta current with domain enabled 13 a rf core delta current with power domain enabled, clock enabled, rf core idle 237 a dma delta current with clock enabled, module idle 130 a timers delta current with clock enabled, module idle 113 a i 2 c delta current with clock enabled, module idle 12 a i2s delta current with clock enabled, module idle 36 a ssi delta current with clock enabled, module idle 93 a uart delta current with clock enabled, module idle 164 a (1) each row is 2048 bits (or 256 bytes) wide. (2) this number is dependent on flash aging and will increase over time and erase cycles. 5.5 general characteristics t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit flash memory supported flash erase cycles before failure 100 k cycles maximum number of write operations per row before erase (1) 83 write operations flash retention 105 c 11.4 years at 105 c flash page/sector erase current average delta current 12.6 ma flash page/sector size 4 kb flash write current average delta current, 4 bytes at a time 8.15 ma flash page/sector erase time (2) 8 ms flash write time (2) 4 bytes at a time 8 s advance information
11 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) numbers given as i/c db. (2) x / y, where x is +n mhz and y is ? n mhz. (3) excluding one exception at f wanted / 2, per bluetooth specification. 5.6 1-mbps gfsk (bluetooth ? low energy technology) ? rx measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, f rf = 2440 mhz, unless otherwise noted. parameter test conditions min typ max unit receiver sensitivity differential mode. measured at the cc2640q1em- 7id sma connector, ber = 10 ? 3 ? 96 dbm receiver saturation differential mode. measured at the cc2640q1em- 7id sma connector, ber = 10 ? 3 4 dbm frequency error tolerance difference between the incoming carrier frequency and the internally generated carrier frequency ? 350 350 khz data rate error tolerance difference between incoming data rate and the internally generated data rate ? 750 750 ppm co-channel rejection (1) wanted signal at ? 67 dbm, modulated interferer in channel, ber = 10 ? 3 ? 6 db selectivity, 1 mhz (1) wanted signal at ? 67 dbm, modulated interferer at 1 mhz, ber = 10 ? 3 7 / 3 (2) db selectivity, 2 mhz (1) wanted signal at ? 67 dbm, modulated interferer at 2 mhz, ber = 10 ? 3 34 / 25 (2) db selectivity, 3 mhz (1) wanted signal at ? 67 dbm, modulated interferer at 3 mhz, ber = 10 ? 3 38 / 26 (2) db selectivity, 4 mhz (1) wanted signal at ? 67 dbm, modulated interferer at 4 mhz, ber = 10 ? 3 42 / 29 (2) db selectivity, 5 mhz or more (1) wanted signal at ? 67 dbm, modulated interferer at 5 mhz, ber = 10 ? 3 32 db selectivity, image frequency (1) wanted signal at ? 67 dbm, modulated interferer at image frequency, ber = 10 ? 3 25 db selectivity, image frequency 1 mhz (1) wanted signal at ? 67 dbm, modulated interferer at 1 mhz from image frequency, ber = 10 ? 3 3 / 26 (2) db out-of-band blocking (3) 30 mhz to 2000 mhz ? 20 dbm out-of-band blocking 2003 mhz to 2399 mhz ? 5 dbm out-of-band blocking 2484 mhz to 2997 mhz ? 8 dbm out-of-band blocking 3000 mhz to 12.75 ghz ? 8 dbm intermodulation wanted signal at 2402 mhz, ? 64 dbm. two interferers at 2405 and 2408 mhz respectively, at the given power level ? 34 dbm spurious emissions, 30 to 1000 mhz conducted measurement in a 50- ? single-ended load. suitable for systems targeting compliance with en 300 328, en 300 440 class 2, fcc cfr47, part 15 and arib std-t-66 ? 71 dbm spurious emissions, 1 to 12.75 ghz conducted measurement in a 50 ? single-ended load. suitable for systems targeting compliance with en 300 328, en 300 440 class 2, fcc cfr47, part 15 and arib std-t-66 ? 62 dbm rssi dynamic range 70 db rssi accuracy 4 db advance information
12 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) suitable for systems targeting compliance with worldwide radio-frequency regulations etsi en 300 328 and en 300 440 class 2 (europe), fcc cfr47 part 15 (us), and arib std-t66 (japan). 5.7 1-mbps gfsk (bluetooth ? low energy technology) ? tx measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, f rf = 2440 mhz, unless otherwise noted. parameter test conditions min typ max unit output power, highest setting differential mode, delivered to a single-ended 50- load through a balun 5 dbm output power, lowest setting delivered to a single-ended 50- load through a balun ? 21 dbm spurious emission conducted measurement (1) f < 1 ghz, outside restricted bands ? 43 dbm f < 1 ghz, restricted bands etsi ? 65 dbm f < 1 ghz, restricted bands fcc ? 76 dbm f > 1 ghz, including harmonics ? 46 dbm (1) probing or otherwise stopping the xtal while the dc-dc converter is enabled may cause permanent damage to the device. (2) the crystal manufacturer ' s specification must satisfy this requirement (3) measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v (4) includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance, as per bluetooth specification. (5) kick-started based on a temperature and aging compensated rcosc_hf using precharge injection. 5.8 24-mhz crystal oscillator (xosc_hf) t c = 25 c, v dds = 3.0 v, unless otherwise noted. (1) parameter test conditions min typ max unit esr equivalent series resistance (2) 6 pf < c l 9 pf 20 60 esr equivalent series resistance (2) 5 pf < c l 6 pf 80 l m motional inductance (2) relates to load capacitance (c l in farads) < 1.6 10 ? 24 / c l 2 h c l crystal load capacitance (2) 5 9 pf crystal frequency (2) (3) 24 mhz crystal frequency tolerance (2) (4) ? 40 40 ppm start-up time (3) (5) 150 s (1) the crystal manufacturer ' s specification must satisfy this requirement. (2) includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance, as per bluetooth specification. 5.9 32.768-khz crystal oscillator (xosc_lf) t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit crystal frequency (1) 32.768 khz crystal frequency tolerance, bluetooth low- energy applications (1) (2) ? 500 500 ppm esr equivalent series resistance (1) 30 100 k c l crystal load capacitance (1) 6 12 pf advance information
13 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) accuracy relative to the calibration source (xosc_hf). 5.10 48-mhz rc oscillator (rcosc_hf) measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit frequency 48 mhz uncalibrated frequency accuracy 1% calibrated frequency accuracy (1) 0.25% start-up time 5 s (1) the frequency accuracy of the real time clock (rtc) is not directly dependent on the frequency accuracy of the 32-khz rc oscillator. the rtc can be calibrated to an accuracy within 500 ppm of 32.768 khz by measuring the frequency error of rcosc_lf relative to xosc_hf and compensating the rtc tick speed. the procedure is explained in running bluetooth ? low energy on cc2640 without 32-khz crystal . 5.11 32-khz rc oscillator (rcosc_lf) measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit calibrated frequency (1) 32.8 khz temperature coefficient 50 ppm/ c (1) using ieee std 1241 ? -2010 for terminology and test methods. (2) input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 v. (3) no missing codes. positive dnl typically varies from +0.3 to +3.5, depending on device (see figure 5-12 ). (4) for a typical example, see figure 5-13 . 5.12 adc characteristics t c = 25 c, v dds = 3.0 v and voltage scaling enabled, unless otherwise noted. (1) parameter test conditions min typ max unit input voltage range 0 vdds v resolution 12 bits sample rate 200 ksps offset internal 4.3-v equivalent reference (2) 2 lsb gain error internal 4.3-v equivalent reference (2) 2.4 lsb dnl (3) differential nonlinearity > ? 1 lsb inl (4) integral nonlinearity 3 lsb enob effective number of bits internal 4.3-v equivalent reference (2) , 200 ksps, 9.6-khz input tone 9.8 bits vdds as reference, 200 ksps, 9.6-khz input tone 10 internal 1.44-v reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-hz input tone 11.1 thd total harmonic distortion internal 4.3-v equivalent reference (2) , 200 ksps, 9.6-khz input tone ? 65 db vdds as reference, 200 ksps, 9.6-khz input tone ? 69 internal 1.44-v reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-hz input tone ? 71 sinad, sndr signal-to-noise and distortion ratio internal 4.3-v equivalent reference (2) , 200 ksps, 9.6-khz input tone 60 db vdds as reference, 200 ksps, 9.6-khz input tone 63 internal 1.44-v reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-hz input tone 69 sfdr spurious-free dynamic range internal 4.3-v equivalent reference (2) , 200 ksps, 9.6-khz input tone 67 db vdds as reference, 200 ksps, 9.6-khz input tone 72 internal 1.44-v reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-hz input tone 73 advance information
14 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated adc characteristics (continued) t c = 25 c, v dds = 3.0 v and voltage scaling enabled, unless otherwise noted. (1) parameter test conditions min typ max unit (5) applied voltage must be within absolute maximum ratings at all times (see section 5.1 ). conversion time serial conversion, time-to-output, 24-mhz clock 50 clock- cycles current consumption internal 4.3-v equivalent reference (2) 0.66 ma current consumption vdds as reference 0.75 ma reference voltage equivalent fixed internal reference (input voltage scaling enabled). for best accuracy, the adc conversion should be initiated through the ti-rtos api to include the gain/offset compensation factors stored in fcfg1. 4.3 (2) (5) v reference voltage fixed internal reference (input-voltage scaling disabled). for the best accuracy, the adc conversion should be initiated through the ti-rtos api to include the gain/offset compensation factors stored in fcfg1. this value is derived from the scaled value (4.3 v) as follows. v ref = 4.3 v 1408 / 4095 1.48 v reference voltage vdds as reference (also known as relative ) (input voltage scaling enabled) vdds v reference voltage vdds as reference (also known as relative ) (input voltage scaling disabled) vdds / 2.82 (5) v input impedance 200 ksps, voltage scaling enabled. capacitive input, input impedance depends on sampling frequency and sampling time > 1 m (1) automatically compensated when using supplied driver libraries. 5.13 temperature sensor measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit resolution 4 c range ? 40 105 c accuracy 5 c supply voltage coefficient (1) 3.2 c/v 5.14 battery monitor measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit resolution 50 mv range 1.8 3.8 v accuracy 13 mv (1) additionally, the bias module must be enabled when running in standby mode. 5.15 continuous time comparator t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit input voltage range 0 vdds v external reference voltage 0 vdds v internal reference voltage dcoupl as reference 1.27 v offset 3 mv hysteresis < 2 mv decision time step from ? 10 mv to 10 mv 0.72 s current consumption when enabled (1) 8.6 a advance information
15 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated 5.16 low-power clocked comparator t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit input voltage range 0 vdds v clock frequency 32 khz internal reference voltage, vdds / 2 1.49 ? 1.51 v internal reference voltage, vdds / 3 1.01 ? 1.03 v internal reference voltage, vdds / 4 0.78 ? 0.79 v internal reference voltage, dcoupl / 1 1.25 ? 1.28 v internal reference voltage, dcoupl / 2 0.63 ? 0.65 v internal reference voltage, dcoupl / 3 0.42 ? 0.44 v internal reference voltage, dcoupl / 4 0.33 ? 0.34 v offset < 2 mv hysteresis < 5 mv decision time step from ? 50 mv to 50 mv < 1 clock-cycle current consumption when enabled 362 na (1) additionally, the bias module must be enabled when running in standby mode. 5.17 programmable current source t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit current source programmable output range 0.25 ? 20 a resolution 0.25 a current consumption (1) including current source at maximum programmable output 23 a (1) refer to ssi timing diagrams figure 5-1 , figure 5-2 , and figure 5-3 . 5.18 synchronous serial interface (ssi) t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit s1 (1) t clk_per (ssiclk period) device operating as slave 12 65024 system clocks s2 (1) t clk_high (ssiclk high time) device operating as slave 0.5 t clk_per s3 (1) t clk_low (ssiclk low time) device operating as slave 0.5 t clk_per s1 (tx only) (1) t clk_per (ssiclk period) one-way communication to slave - device operating as master 4 65024 system clocks s1 (tx and rx) (1) t clk_per (ssiclk period) normal duplex operation - device operating as master 8 65024 system clocks s2 (1) t clk_high (ssiclk high time) device operating as master 0.5 t clk_per s3 (1) t clk_low (ssiclk low time) device operating as master 0.5 t clk_per advance information
16 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated figure 5-1. ssi timing for ti frame format (frf = 01), single transfer timing measurement figure 5-2. ssi timing for microwire frame format (frf = 10), single transfer ssiclk ssifss ssitx ssirx msb lsb s2 s3 s1 4 to 16 bits advance information 0 ssiclk ssifss ssitx ssirx msb lsb msb lsb s2 s3 s1 8-bit control 4 to 16 bits output data
17 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated figure 5-3. ssi timing for spi frame format (frf = 00), with sph = 1 5.19 dc characteristics parameter test conditions min typ max unit t a = 25 c, v dds = 1.8 v gpio voh at 8-ma load iocurr = 2, high-drive gpios only 1.32 1.54 v gpio vol at 8-ma load iocurr = 2, high-drive gpios only 0.26 0.32 v gpio voh at 4-ma load iocurr = 1 1.32 1.58 v gpio vol at 4-ma load iocurr = 1 0.21 0.32 v gpio pullup current input mode, pullup enabled, vpad = 0 v 71.7 a gpio pulldown current input mode, pulldown enabled, vpad = vdds 21.1 a gpio high/low input transition, no hysteresis ih = 0, transition between reading 0 and reading 1 0.88 v gpio low-to-high input transition, with hysteresis ih = 1, transition voltage for input read as 0 1 1.07 v gpio high-to-low input transition, with hysteresis ih = 1, transition voltage for input read as 1 0 0.74 v gpio input hysteresis ih = 1, difference between 0 1 and 1 0 points 0.33 v ssiclk (spo = 1) ssitx (master) ssirx (slave) lsb ssiclk (spo = 0) s2 s1 ssifss lsb s3 msb msb advance information
18 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated dc characteristics (continued) parameter test conditions min typ max unit (1) each gpio is referenced to a specific vdds pin. see the technical reference manual listed in section 8.3 for more details. t a = 25 c, v dds = 3.0 v gpio voh at 8-ma load iocurr = 2, high-drive gpios only 2.68 v gpio vol at 8-ma load iocurr = 2, high-drive gpios only 0.33 v gpio voh at 4-ma load iocurr = 1 2.72 v gpio vol at 4-ma load iocurr = 1 0.28 v t a = 25 c, v dds = 3.8 v gpio pullup current input mode, pullup enabled, vpad = 0 v 277 a gpio pulldown current input mode, pulldown enabled, vpad = vdds 113 a gpio high/low input transition, no hysteresis ih = 0, transition between reading 0 and reading 1 1.67 v gpio low-to-high input transition, with hysteresis ih = 1, transition voltage for input read as 0 1 1.94 v gpio high-to-low input transition, with hysteresis ih = 1, transition voltage for input read as 1 0 1.54 v gpio input hysteresis ih = 1, difference between 0 1 and 1 0 points 0.4 v t a = 25 c vih lowest gpio input voltage reliably interpreted as a ? high ? 0.8 vdds (1) vil highest gpio input voltage reliably interpreted as a ? low ? 0.2 vdds (1) (1) c/w = degrees celsius per watt. (2) these values are based on a jedec-defined 2s2p system (with the exception of the theta jc [r jc ] value, which is based on a jedec-defined 1s0p system) and will change based on environment as well as application. for more information, see the following eia/jedec standards: ? jesd51-2, integrated circuits thermal test method environmental conditions - natural convection (still air) ? jesd51-3, low effective thermal conductivity test board for leaded surface mount packages ? jesd51-7, high effective thermal conductivity test board for leaded surface mount packages ? jesd51-9, test boards for area array surface mount package thermal measurements power dissipation of 2 w and an ambient temperature of 70 o c is assumed. 5.20 thermal resistance characteristics over operating free-air temperature range (unless otherwise noted) name description rgz ( c/w) (1) (2) r ja junction-to-ambient thermal resistance 29.6 r jc(top) junction-to-case (top) thermal resistance 15.7 r jb junction-to-board thermal resistance 6.2 psi jt junction-to-top characterization parameter 0.3 psi jb junction-to-board characterization parameter 6.2 r jc(bot) junction-to-case (bottom) thermal resistance 1.9 advance information
19 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated (1) for smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22- f vdds input capacitor (see figure 7-1 ) must be used to ensure compliance with this slew rate. (2) applications using rcosc_lf as sleep timer must also consider the drift in frequency caused by a change in temperature (see section 5.11 ). (3) t a = ? 40 c to +105 c, v dds = 1.8 v to 3.8 v, unless otherwise noted. 5.21 timing requirements min nom max unit rising supply-voltage slew rate 0 100 mv/ s falling supply-voltage slew rate 0 20 mv/ s falling supply-voltage slew rate, with low-power flash settings (1) 3 mv/ s positive temperature gradient in standby (2) no limitation for negative temperature gradient, or outside standby mode 5 c/s control input ac characteristics (3) reset_n low duration 1 s 5.22 switching characteristics measured on the ti cc2640q1em-7id reference design with t c = 25 c, v dds = 3.0 v, unless otherwise noted. parameter test conditions min typ max unit wakeup and timing idle active 14 s standby active 151 s shutdown active 1015 s advance information
20 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated 5.23 typical characteristics figure 5-4. active mode (mcu running, no peripherals) current consumption vs temperature figure 5-5. active mode (mcu running, no peripherals) current consumption vs supply voltage (vdds) figure 5-6. standby mode current consumption with rcosc rtc vs temperature figure 5-7. soc adc effective number of bits vs input frequency (internal reference, no scaling) figure 5-8. soc adc output vs supply voltage (fixed input, internal reference, no scaling) figure 5-9. soc adc output vs temperature (fixed input, internal reference, no scaling) vdds (v) adc code 1.8 2.3 2.8 3.3 3.8 1004.8 1005 1005.2 1005.4 1005.6 1005.8 1006 1006.2 1006.4 d012 temperature ( q c) adc code -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 1004.5 1005 1005.5 1006 1006.5 1007 1007.5 d013 temperature ( q c) current (ua) -20 -10 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 3 3.5 4 d008 standby mode current input frequency (hz) effective number of bits 200 300 500 1000 2000 5000 10000 20000 100000 9.4 9.6 9.8 10 10.2 10.4 10.6 10.8 11 11.2 11.4 d009 fs= 200 khz, no averaging fs= 200 khz, 32 samples averaging temperature ( q c) active mode current consumpstion (ma) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 2.85 2.9 2.95 3 3.05 3.1 d006 active mode current vdds (v) current consumption (ma) 1.8 2.3 2.8 3.3 3.8 2 2.5 3 3.5 4 4.5 5 d007 active mode current advance information
21 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 specifications copyright ? 2017, texas instruments incorporated typical characteristics (continued) figure 5-10. soc adc enob vs sampling frequency (input frequency = fs / 10) figure 5-11. supply current vs temperature figure 5-12. soc adc dnl vs adc code (internal reference, no scaling) figure 5-13. soc adc inl vs adc code (internal reference, no scaling) temperature ( q c) standby current ( p a) -40 -20 0 20 40 60 80 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 d021 advance information adc code inl 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 -4 -3 -2 -1 0 1 2 3 d011 adc code dnl 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 d010 sampling frequency (hz) enob 9.6 9.7 9.8 9.9 10 10.1 10.2 10.3 10.4 10.5 1k 10k 100k 200k d009a enob internal reference (no averaging) enob internal reference (32 samples averaging)
22 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated 6 detailed description 6.1 overview section 6.2 shows the core modules of the cc26xx product family. 6.2 functional block diagram advance information aec-q100 automotive grade simplelink CC2640R2F-Q1 wireless mcu main cpu 128-kb flash s ensor controller cjtag 20-kb sram rom arm cortex-m3 dc-dc converter rf core arm cortex-m0 dsp modem 4-kb sram rom sensor controller engine 2 comparator 12-bit adc, 200 ks/s constant current source spi-i2c digital sensor if 2-kb sram time-to-digital converter g eneral peripherals / modules 4 32-bit timers 2 ssi (spi, w, ti) watchdog timer temp. / batt. monitor rtc i2c uart i2s 31 gpios aes 32 ch. dma adc digital pll trng adc 8-kb cache copyright ? 2017, texas instruments incorporated
23 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated 6.3 main cpu the automotive grade simplelink CC2640R2F-Q1 wireless mcu contains an arm cortex-m3 (cm3) 32- bit cpu, which runs the application and the higher layers of the protocol stack. the cm3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. cm3 features include the following: ? 32-bit arm cortex-m3 architecture optimized for small-footprint embedded applications ? outstanding processing performance combined with fast interrupt handling ? arm thumb ? -2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit arm core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications: ? single-cycle multiply instruction and hardware divide ? atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral control ? unaligned data access, enabling data to be efficiently packed into memory ? fast code execution permits slower processor clock or increases sleep mode time ? harvard architecture characterized by separate buses for instruction and data ? efficient processor core, system, and memories ? hardware division and fast digital-signal-processing oriented multiply accumulate ? saturating arithmetic for signal processing ? deterministic, high-performance interrupt handling for time-critical applications ? enhanced system debug with extensive breakpoint and trace capabilities ? serial wire trace reduces the number of pins required for debugging and tracing ? migration from the arm7 ? processor family for better performance and power efficiency ? optimized for single-cycle flash memory use ? ultra-low power consumption with integrated sleep modes ? 1.25 dmips per mhz 6.4 rf core the rf core contains an arm cortex-m0 processor that interfaces the analog rf and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. the rf core offers a high level, command-based api to the main cpu. the rf core is capable of autonomously handling the time-critical aspects of the radio protocols (bluetooth low energy) thus offloading the main cpu and leaving more resources for the user application. the rf core has a dedicated 4-kb sram block and runs initially from separate rom memory. the arm cortex-m0 processor is not programmable by customers. advance information
24 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated 6.5 sensor controller the sensor controller contains circuitry that can be selectively enabled in standby mode. the peripherals in this domain may be controlled by the sensor controller engine which is a proprietary power-optimized cpu. this cpu can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main cm3 cpu. the sensor controller is set up using a pc-based configuration tool, called sensor controller studio, and potential use cases may be (but are not limited to): ? analog sensors using integrated adc ? digital sensors using gpios, bit-banged i 2 c, and spi ? uart communication for sensor reading or debugging ? capacitive sensing ? waveform generation ? pulse counting ? keyboard scan ? quadrature decoder for polling rotation sensors ? oscillator calibration note texas instruments provides application examples for some of these use cases, but not for all of them. the peripherals in the sensor controller include the following: ? the low-power clocked comparator can be used to wake the device from any state in which the comparator is active. a configurable internal reference can be used in conjunction with the comparator. the output of the comparator can also be used to trigger an interrupt or the adc. ? capacitive sensing functionality is implemented through the use of a constant current source, a time- to-digital converter, and a comparator. the continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. the sensor controller will take care of baseline tracking, hysteresis, filtering and other related functions. ? the adc is a 12-bit, 200-ksamples/s adc with eight inputs and a built-in voltage reference. the adc can be triggered by many different sources, including timers, i/o pins, software, the analog comparator, and the rtc. ? the sensor controller also includes a spi ? i 2 c digital interface. ? the analog modules can be connected to up to eight different gpios. the peripherals in the sensor controller can also be controlled from the main application processor. advance information
25 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated (1) up to 16 pins can be connected to the sensor controller. up to 8 of these pins can be connected to analog modules. table 6-1. gpios connected to the sensor controller (1) analog capable 7 7 rgz dio number y 30 y 29 y 28 y 27 y 26 y 25 y 24 y 23 n 7 n 6 n 5 n 4 n 3 n 2 n 1 n 0 6.6 memory the flash memory provides nonvolatile storage for code and data. the flash memory is in-system programmable. the sram (static ram) can be used for both storage of data and execution of code and is split into two 4-kb blocks and two 6-kb blocks. retention of the ram contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. in addition, if flash cache is disabled, the 8-kb cache can be used as a general-purpose ram. the rom provides preprogrammed embedded ti-rtos kernel, driverlib and lower layer protocol stack software (bluetooth low energy controller). it also contains a bootloader that can be used to reprogram the device using spi or uart. 6.7 debug the on-chip debug support is done through a dedicated cjtag (ieee 1149.7) or jtag (ieee 1149.1) interface. advance information
26 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated (1) not including rtos overhead 6.8 power management to minimize power consumption, the CC2640R2F-Q1 device supports a number of power modes and power management features (see table 6-2 ). table 6-2. power modes mode software configurable power modes reset pin held active idle standby shutdown cpu active off off off off flash on available off off off sram on on on off off radio available available off off off supply system on on duty cycled off off current 1.45 ma + 31 a/mhz 550 a 1 a 0.15 a 0.1 a wake-up time to cpu active (1) ? 14 s 151 s 1015 s 1015 s register retention full full partial no no sram retention full full full no no high-speed clock xosc_hf or rcosc_hf xosc_hf or rcosc_hf off off off low-speed clock xosc_lf or rcosc_lf xosc_lf or rcosc_lf xosc_lf or rcosc_lf off off peripherals available available off off off sensor controller available available available off off wake up on rtc available available available off off wake up on pin edge available available available available off wake up on reset pin available available available available available brown out detector (bod) active active duty cycled off n/a power on reset (por) active active active active n/a in active mode, the application cm3 cpu is actively executing code. active mode provides normal operation of the processor and all of the peripherals that are currently enabled. the system clock can be any available clock source (see table 6-2 ). in idle mode, all active peripherals can be clocked, but the application cpu core and memory are not clocked and no code is executed. any interrupt event will bring the processor back into active mode. in standby mode, only the always-on domain (aon) is active. an external wake event, rtc event, or sensor-controller event is required to bring the device back to active mode. mcu peripherals with retention do not need to be reconfigured when waking up again, and the cpu continues execution from where it went into standby mode. all gpios are latched in standby mode. in shutdown mode, the device is turned off entirely, including the aon domain and the sensor controller. the i/os are latched with the value they had before entering shutdown mode. a change of state on any i/o pin defined as a wake from shutdown pin wakes up the device and functions as a reset trigger. the cpu can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. the only state retained in this mode is the latched i/o state and the flash memory contents. the sensor controller is an autonomous processor that can control the peripherals in the sensor controller independently of the main cpu, which means that the main cpu does not have to wake up, for example, to execute an adc sample or poll a digital sensor over spi. the main cpu saves both current and wake-up time that would otherwise be wasted. the sensor controller studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main cpu. advance information
27 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated 6.9 clock systems the CC2640R2F-Q1 supports two external and two internal clock sources. a 24-mhz crystal is required as the frequency reference for the radio. this signal is doubled internally to create a 48-mhz clock. the 32-khz crystal is optional. bluetooth low energy requires a slow-speed clock with better than 500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. the internal 32-khz rc oscillator can in some use cases be compensated to meet the requirements. the low-speed crystal oscillator is designed for use with a 32-khz watch-type crystal. the internal high-speed oscillator (48-mhz) can be used as a clock source for the cpu subsystem. the internal low-speed oscillator (32.768-khz) can be used as a reference if the low-power crystal oscillator is not used. the 32-khz clock source can be used as external clocking reference through gpio. 6.10 general peripherals and modules the i/o controller controls the digital i/o pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to i/o pins in a flexible manner. all digital i/os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). when configured as an output, pins can function as either push-pull or open-drain. five gpios have high drive capabilities (marked in bold in section 4 ). the ssis are synchronous serial interfaces that are compatible with spi, microwire, and synchronous serial interfaces from texas instruments ? . the ssis support both spi master and slave up to 4 mhz. the uart implements a universal asynchronous receiver/transmitter function. it supports flexible baud- rate generation up to a maximum of 3 mbps and is compatible with the bluetooth hci specifications. timer 0 is a general-purpose timer module (gptm), which provides two 16-bit timers. the gptm can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a pwm module. timer 1, timer 2, and timer 3 are also gptms. each of these timers is functionally equivalent to timer 0. in addition to these four timers, the rf core has its own timer to handle timing for rf protocols; the rf timer can be synchronized to the rtc. the i 2 c interface is used to communicate with devices compatible with the i 2 c standard. the i 2 c interface is capable of 100-khz and 400-khz operation, and can serve as both i 2 c master and i 2 c slave. the trng module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (ivs), and other random number requirements. the trng is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit. the watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. the watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached. advance information
28 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 detailed description copyright ? 2017, texas instruments incorporated the device includes a direct memory access ( dma) controller. the dma controller provides a way to offload data transfer tasks from the cm3 cpu, allowing for more efficient use of the processor and the available bus bandwidth. the dma controller can perform transfer between memory and peripherals. the dma controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. some features of the dma controller include the following (this is not an exhaustive list): ? highly flexible and configurable channel operation of up to 32 channels ? transfer modes: ? memory-to-memory ? memory-to-peripheral ? peripheral-to-memory ? peripheral-to-peripheral ? data sizes of 8, 16, and 32 bits the aon domain contains circuitry that is always enabled, except in shutdown mode (where the digital supply is off). this circuitry includes the following: ? the rtc can be used to wake the device from any state where it is active. the rtc contains three compare and one capture registers. with software support, the rtc can be used for clock and calendar operation. the rtc is clocked from the 32-khz rc oscillator or crystal. the rtc can also be compensated to tick at the correct frequency even when the internal 32-khz rc oscillator is used instead of a crystal. ? the battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse temperature measure. 6.11 voltage supply domains the CC2640R2F-Q1 device can interface to three different voltage domains. on-chip level converters ensure correct operation when the signal voltage on each input or output pin is set with respect to the corresponding supply pin (vdds, vdds2, or vdds3). table 6-3 lists the pin-to-vdds mapping. (1) vdds_dcdc must be connected to vdds on the pcb table 6-3. pin function to vdds mapping table voltage domain vqfn 7 7 (rgz) vdds (1) dio 23 to dio 30 reset_n vdds2 dio 0 to dio 11 vdds3 dio 12 to dio 22 jtag 6.12 system architecture depending on the product configuration, CC2640R2F-Q1 can function either as a wireless network processor (wnp ? a device running the wireless protocol stack with the application running on a separate mcu), or as a system-on-chip (soc), with the application and protocol stack running on the arm cortex- m3 core inside the device. in the first case, the external host mcu communicates with the device using spi or uart. in the second case, the application must be written according to the application framework supplied with the wireless protocol stack. advance information
29 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 application, implementation, and layout copyright ? 2017, texas instruments incorporated 7 application, implementation, and layout note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti's customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 7.1 application information very few external components are required for the operation of the CC2640R2F-Q1 device. this section provides general information about the differential configuration when using the CC2640R2F-Q1 device in an application, and an example application circuit with schematics and layout is shown in figure 7-1 , figure 7-2 , figure 7-3 , and figure 7-4 . this is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com . figure 7-1 shows the differential rf front-end configuration option with internal biasing. see the cc2640q1em-7id reference design for this option. figure 7-1. CC2640R2F-Q1 application circuit antenna (50 q ) 1 pf 1 pf 2.4 nh 2.4 to 2.7 nh 6.8 pf pin 1 (rf p) pin 2 (rf n) differential operation cc26xx (gnd exposed die attached pad ) pin 1 (rf p) pin 2 (rf n) 24-mhz xtal (load capacitors on chip) 10 f 10 h optional inductor is needed only for dc-dc operation 12 pf 2 nh 2 nh 1 pf input decoupling 10 f to 22 f to vddr pins vdds_dcdc dcdc_sw copyright ? 2017, texas instruments incorporated advance information
30 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 application, implementation, and layout copyright ? 2017, texas instruments incorporated figure 7-2 shows the various supply voltage configuration options for CC2640R2F-Q1. not all power supply decoupling capacitors or digital i/os are shown. for a detailed overview of power supply decoupling and wiring, see the ti reference designs and the cc13x0, cc26x0 simplelink wireless mcu technical reference manual . figure 7-2. supply voltage configurations internal dc-dc regulator internal ldo regulator (gnd exposed die attached pad) pin 1 (rf p) pin 2 (rf n) 24-mhz xtal (load capacitors on chip) 10 f 10 h vdds_dcdc input decoupling 10 f to 22 f to all vddr pins vdds_dcdc pin dcdc_sw pin 1.8 v to 3.8 v to all vdds pins vddr vddr vdds vdds cc26xx (gnd exposed die attached pad) pin 1 (rf p) pin 2 (rf n) 24-mhz xtal (load capacitors on chip) vdds_dcdc input decoupling 10 f to 22 f to all vddr pins vdds_dcdc pin nc 1.8-v to 3.8-v supply voltage vddr vddr vdds vdds cc26xx 10 f to all vdds pins copyright ? 2017, texas instruments incorporated advance information
copyright ? 2017, texas instruments incorporated application, implementation, and layout submit documentation feedback product folder links: CC2640R2F-Q1 31 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 7.2 7 7 internal differential (7id) application circuit figure 7-3. 7 7 internal differential (7id) application circuit vdds decoupling capacitors pin 22 pin 44 pin 13 pin 34 pin 48 pin 45 vddr decoupling capacitors 50-ohm antenna place l1 and c8 close to pin 33 dcdc_sw jtag_tck jtag_tms dcdc_sw nreset dio1 dio0 dio3 dio2 dio5 dio4 dio7 dio6 dio9 dio8 dio11 dio10 dio13 dio12 dio15 dio14 dio17 dio16 dio19 dio18 dio21 dio20 dio23 dio22 dio25 dio24 dio27 dio26 dio29 dio28 dio30 vdd_eb vdds vddr vdds vddr vdds c12 dnm c17 16pf c6 10uf c16 100nf fl1 blm18he152sz1 c18 16pf c23 dnm c10 0402 l1 10uh c8 10uf cc2640r2ftwrgzrq1 u1a jtag_tmsc 24 jtag_tckc 25 reset_n 35 dcdc_sw 33 x32k_q1 3 x32k_q2 4 dcoupl 23 vdds2 13 vdds3 22 vdds 44 vdds_dcdc 34 vddr 45 vddr_rf 48 rf_p 1 rf_n 2 x24m_n 46 x24m_p 47 egp/gnd 49 y2 24mhz 1 2 4 3 c9 100nf c14 12pf c13 1pf c19 1uf c7 100nf l13 2nh 1 2 c2 dnm c22 dnm r1 100k l12 2nh 1 2 c4 100nf c5 100nf l21 2.4nh 1 2 c3 100nf l11 2.4nh 1 2 c21 1pf c11 1pf cc2640r2ftwrgzrq1 u1b dio_0 5 dio_1 6 dio_2 7 dio_3 8 dio_4 9 dio_5 10 dio_6 11 dio_7 12 dio_8 14 dio_9 15 dio_10 16 dio_11 17 dio_12 18 dio_13 19 dio_14 20 dio_15 21 dio_16 26 dio_17 27 dio_18 28 dio_19 29 dio_20 30 dio_21 31 dio_22 32 dio_23 36 dio_24 37 dio_25 38 dio_26 39 dio_27 40 dio_28 41 dio_29 42 dio_30 43 y1 32.768khz c31 6.8pf a1 2.4ghz 1 c20 100nf copyright ? 2016, texas instruments incorporated advance information
32 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 application, implementation, and layout copyright ? 2017, texas instruments incorporated 7.2.1 layout figure 7-4. layout advance information
33 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 device and documentation support copyright ? 2017, texas instruments incorporated 8 device and documentation support 8.1 device nomenclature to designate the stages in the product development cycle, ti assigns prefixes to all part numbers and date-code. each device has one of three prefixes/identifications: x, p, or null (no prefix) (for example, CC2640R2F-Q1 is in production; therefore, no prefix/identification is assigned). device development evolutionary flow: x experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. p prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null production version of the silicon die that is fully qualified. production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. ti's standard warranty applies. predictions show that prototype devices (x or p) have a greater failure rate than the standard production devices. texas instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. only qualified production devices are to be used. ti device nomenclature also includes a suffix with the device family name. this suffix indicates the package type (for example, rgz ). for orderable part numbers of the CC2640R2F-Q1 device package types, see the package option addendum of this document, the ti website ( www.ti.com ), or contact your ti sales representative. figure 8-1. device nomenclature simplelink? multistandard wireless mcu device family prefix cc26 40 x = experimental device p = prototype blank = qualified device ftw package designator rgz = 48-pin vqfn (very thin quad flatpack no-lead) r/t r = large reelt = small reel r2 rom revision 2 flash = 128kb device 40 = low energy bluetooth rgz f = flasht = grade 2, 105c w = wettable flanks q1 q1 = q100 advance information
34 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 device and documentation support copyright ? 2017, texas instruments incorporated 8.2 tools and software ti offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. the following products support development of the CC2640R2F-Q1 device applications: software tools: smartrf studio 7 : smartrf studio is a pc application that helps designers of radio systems to easily evaluate the rf-ic at an early stage in the design process. ? test functions for sending and receiving radio packets, continuous wave transmit and receive ? evaluate rf performance on custom boards by wiring it to a supported evaluation board or debugger ? can also be used without any hardware, but then only to generate, edit and export radio configuration settings ? can be used in combination with several development kits for ti's ccxxxx rf-ics sensor controller studio : sensor controller studio provides a development environment for the cc26xx sensor controller. the sensor controller is a proprietary, power-optimized cpu in the cc26xx, which can perform simple background tasks autonomously and independent of the system cpu state. ? allows for sensor controller task algorithms to be implemented using a c-like programming language ? outputs a sensor controller interface driver, which incorporates the generated sensor controller machine code and associated definitions ? allows for rapid development by using the integrated sensor controller task testing and debugging functionality. this allows for live visualization of sensor data and algorithm verification. ides and compilers: code composer studio: ? integrated development environment with project management tools and editor ? code composer studio (ccs) 6.1 and later has built-in support for the cc26xx device family ? best support for xds debuggers; xds100v3, xds110 and xds200 ? high integration with ti-rtos with support for ti-rtos object view iar embedded workbench for arm ? integrated development environment with project management tools and editor ? iar ewarm 7.30.3 and later has built-in support for the cc26xx device family ? broad debugger support, supporting xds100v3, xds200, iar i-jet and segger j-link ? integrated development environment with project management tools and editor ? rtos plugin available for ti-rtos for a complete listing of development-support tools for the CC2640R2F-Q1 platform, visit the texas instruments website at www.ti.com . for information on pricing and availability, contact the nearest ti field sales office or authorized distributor. advance information
35 CC2640R2F-Q1 www.ti.com swrs201 ? january 2017 submit documentation feedback product folder links: CC2640R2F-Q1 device and documentation support copyright ? 2017, texas instruments incorporated 8.3 documentation support to receive notification of documentation updates, navigate to the device product folder on ti.com ( CC2640R2F-Q1 ). in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. the current documentation that describes the CC2640R2F-Q1 devices, related peripherals, and other technical collateral is listed in the following. technical reference manual cc13xx, cc26xx simplelink ? wireless mcu technical reference manual spacer errata cc2640 simplelink ? wireless mcu errata 8.4 texas instruments low-power rf website texas instruments' low-power rf website has all the latest products, application and design notes, faq section, news and events updates. go to www.ti.com/lprf . 8.5 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community the ti engineer-to-engineer (e2e) community was created to foster collaboration among engineers. at e2e.ti.com , you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. ti embedded processors wiki texas instruments embedded processors wiki. established to help developers get started with embedded processors from texas instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. low-power rf online community wireless connectivity section of the ti e2e support community ? forums, videos, and blogs ? rf design help ? e2e interaction join here . low-power rf developer network texas instruments has launched an extensive network of low-power rf development partners to help customers speed up their application development. the network consists of recommended companies, rf consultants, and independent design houses that provide a series of hardware module products and design services, including: ? rf circuit, low-power rf, and zigbee design services ? low-power rf and zigbee module solutions and development tools ? rf certification services and rf circuit manufacturing for help with modules, engineering services or development tools: search the low-power rf developer network to find a suitable partner. www.ti.com/lprfnetwork advance information
36 CC2640R2F-Q1 swrs201 ? january 2017 www.ti.com submit documentation feedback product folder links: CC2640R2F-Q1 mechanical, packaging, and orderable information copyright ? 2017, texas instruments incorporated 8.6 additional information texas instruments offers a wide selection of cost-effective, low-power rf solutions for proprietary and standard-based wireless applications for use in automotive, industrial and consumer applications. the selection includes rf transceivers, rf transmitters, rf front ends, and systems-on-chips as well as various software solutions for the sub-1 ghz and 2.4-ghz frequency bands. in addition, texas instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. the low-power rf e2e online community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world. with a broad selection of product solutions, end-application possibilities, and a range of technical support, texas instruments offers the broadest low-power rf portfolio. 8.7 trademarks simplelink, smartrf, code composer studio, launchpad, texas instruments, e2e are trademarks of texas instruments. arm7 is a trademark of arm limited (or its subsidiaries). arm, cortex, arm thumb are registered trademarks of arm limited (or its subsidiaries). bluetooth is a registered trademark of bluetooth sig, inc. coremark is a registered trademark of embedded microprocessor benchmark consortium. iar embedded workbench is a registered trademark of iar systems ab. ieee std 1241 is a trademark of institute of electrical and electronics engineers, incorporated. zigbee is a registered trademark of zigbee alliance, inc. all other trademarks are the property of their respective owners. 8.8 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.9 export control notice recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the u.s., eu, and other export administration regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by u.s. or other applicable laws, without obtaining prior authorization from u.s. department of commerce and other competent government authorities to the extent required by those laws. 8.10 glossary ti glossary this glossary lists and explains terms, acronyms, and definitions. 9 mechanical, packaging, and orderable information 9.1 packaging information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. advance information
package option addendum www.ti.com 2-feb-2017 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples cc2640r2ftwrgzrq1 preview vqfn rgz 48 2500 tbd call ti call ti -40 to 105 cc2640r2ftwrgztq1 preview vqfn rgz 48 250 tbd call ti call ti -40 to 105 xcc2640r2ftwrgztq1 preview vqfn rgz 48 2500 tbd call ti call ti -40 to 105 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 2-feb-2017 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of CC2640R2F-Q1 : ? catalog: cc2640r2f note: qualified version definitions: ? catalog - ti's standard catalog product

important notice for ti design information and resources texas instruments incorporated ( ? ti ? ) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, ? ti resources ? ) are intended to assist designers who are developing applications that incorporate ti products; by downloading, accessing or using any particular ti resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this notice. ti ? s provision of ti resources does not expand or otherwise alter ti ? s applicable published warranties or warranty disclaimers for ti products, and no additional obligations or liabilities arise from ti providing such ti resources. ti reserves the right to make corrections, enhancements, improvements and other changes to its ti resources. you understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all ti products used in or for your applications) with all applicable regulations, laws and other applicable requirements. you represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. you agree that prior to using or distributing any applications that include ti products, you will thoroughly test such applications and the functionality of such ti products as used in such applications. ti has not conducted any testing other than that specifically described in the published documentation for a particular ti resource. you are authorized to use, copy and modify any individual ti resource only in connection with the development of applications that include the ti product(s) identified in such ti resource. no other license, express or implied, by estoppel or otherwise to any other ti intellectual property right, and no license to any technology or intellectual property right of ti or any third party is granted herein, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti products or services are used. information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. use of ti resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. ti resources are provided ? as is ? and with all faults. ti disclaims all other warranties or representations, express or implied, regarding ti resources or use thereof, including but not limited to accuracy or completeness, title, any epidemic failure warranty and any implied warranties of merchantability, fitness for a particular purpose, and non-infringement of any third party intellectual property rights. ti shall not be liable for and shall not defend or indemnify you against any claim, including but not limited to any infringement claim that relates to or is based on any combination of products even if described in ti resources or otherwise. in no event shall ti be liable for any actual, direct, special, collateral, indirect, punitive, incidental, consequential or exemplary damages in connection with or arising out of ti resources or use thereof, and regardless of whether ti has been advised of the possibility of such damages. you agree to fully indemnify ti and its representatives against any damages, costs, losses, and/or liabilities arising out of your non- compliance with the terms and provisions of this notice. this notice applies to ti resources. additional terms apply to the use and purchase of certain types of materials, ti products and services. these include; without limitation, ti ? s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm ), evaluation modules , and samples ( http://www.ti.com/sc/docs/sampterms.htm ). mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2017, texas instruments incorporated

▲Up To Search▲

Price & Availability of CC2640R2F-Q1

	To Download CC2640R2F-Q1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .